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Area Development - Site Selection, Facility Planning and Workforce Development

DuPont Semiconductor Technologies Plans Glasgow, Delaware, Operations

08/27/2022
DuPont Semiconductor Technologies, a division of DuPont Electronics & Industrial, will establish operations in Glasgow, Delaware. The $50 million project is expected to create 10 jobs.

The new 385,000-square-foot facility will likely be the first building in a 1-million-square-foot logistics park planned near Route 896 and Old Cooch's Bridge Road.

“DuPont materials for chemical mechanical planarization are an essential part of the semiconductor supply chain, used by customers around the world in highly sensitive semiconductor chip fabrication,” said John Singer, vice president, Integrated Operations, DuPont Electronics & Industrial. “As we expand to meet industry growth, we’re pleased to have identified a new facility near our existing CMP manufacturing operations in Delaware, where we can continue to have close collaboration with our experienced colleagues in operations, engineering, quality and other interconnected teams.”

State officials approved grants up to $1.64 million to support job growth and construction of the building. The state's grants include a capital expenditure grant for construction of $1,578,000 and a jobs grant of $65,550 tied to the creation of about 10 positions.

“The DuPont Company has been part of Delaware’s DNA for 220 years. With this expansion of their semiconductor division, the company is showing their commitment to our state and workforce,” added Governor John Carney. “This site will bring with it a new 385,000-square-foot facility and 10 new jobs close to its existing Newark campus at a time when semiconductors are needed more than ever. Thank you to DuPont Electronics & Industrial for continuing to make Delaware a part of the DuPont story.”

DuPont Semiconductor Technologies delivers materials for semiconductor fabrication, packaging and assembly. In Delaware, the Semiconductor Technologies team manufactures materials used in chemical mechanical planarization (CMP), a step in modern semiconductor fabrication processes.

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